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pISSN : 1598-706X / eISSN : 2288-8381


(논문)연구논문

한국주조공학회지 (17권3호 245-251)

A Study on Wetting, Interfacial Reaction and Mechanical Properties between Sn-Bi-Ag System Solders and Cu Substrate

Sn-Bi-Ag계 땜납과 Cu기판과의 젖음성, 계면 반응 및 기계적 성질에 관한 연구

Youn-Jong Seo*, Kyung-Ku Lee**, Doh-Jae Lee

Chonnam National University, *Kwangju Chonnam Regional Small and Medium Business offic, ** Hanlyo Sanup University

Abstract

Solderability, interfacial reaction and mechanical properties of joint between Sn-Bi-Ag base solder and Cu-substrate were studied. Solders were subjected to aging treatments to see the change of mechanical properties for up to 30 days at 100℃, and then also examined the changes of microstructure and morphology of interfacial compound. Sn-Bi-Ag base solder showed about double tensile strength comparing to Pb-Sn eutectic solder. Addition of 0.7wt%Al in the Sn-Bi-Ag alloy increase spread area on Cu substrate under R-flux and helps to reduce the growth of intermetallic compound during heat-treatment. According to the aging experiments of Cu/solder joint, interfacial intermetallic compound layer was exhibited a parabolic growth to aging time. The result of EDS, it is supposed that the soldered interfacial zone was composed of Cu_6Sn_5.

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