한국주조공학회

An Al-composite material was fabricated with using the rheocompocasting process and the microstructure of the Al-Cu/SiCp composite material was investigated depending on the stirring times and the amount of Ti additions. The distribution of SiC dispersion shows the good result at the stirring time of 30 min. The degree of microdistribution of the Al_2Cu and SiCp is improved when the amount of Ti addition is increased. At the compositon of 0.3%Ti, the primary solid is the compound of Al_3Ti and no exist of the SiCp and Al_2Cu phase around the primary Al_3Ti. In the process of compositization, SiCp is found at the primary and final solid parts and is found at the final solid part after remelting. Al_2Cu and SiCp are distributed around and outside of dendrite or independently after remelting, which is different from the process of compositization.