pISSN : 1598-706X / eISSN : 2288-8381
한국주조공학회지 (13권4호 342-349)
A Study on the Thermal Properties of Al-xSi-2Cu-1Mg/ySiC(x:6, 12, 18. y:0~10wt.%) Composite Materials
Al-xSi-2Cu-1Mg/ySiC(x:6, 12, 18. y:0~10wt.%)계 복합재료의 열적성질에 관한 연구
Sang-Joon Park*, Won-Yong Jo*, Se-Seon Kang**, Yoon-Su Lim**, Hyuk-Mu Kwon***, Eui-Park Yoon****
*Cheon-An National Junior Technical College, **Taejeon National University of Technology, ***Chung Nam National University, ****Hanyang University
The purpose of this study is to obtain basic information on the particle dispersion, the coefficient of thermal expansion and the thermal conductivity of compocasted Al-xSi-2Cu-1Mg/ySiC(x:6, 12, 18. y:0~10wt.%) composite. With increasing the content of SiC particles, the thermal expension coefficient and the thermal conductivity decrease. The coefficient of thermal expension between 20 and 300℃ is 21.3X10^{-6}/^℃~18.0X10^{-6}/^℃ for the Al-Si alloys and 18.4X10^{-6}/^ ℃~16.0X10^{-6}/^℃ for the composite with 10wt.% SiC. The thermal conductivity at 300℃ is 121~169W•m^{-1}•k^{-1} for the Al-Si alloys and 114~159W•m^{-1}{\cdot}k^{-1} for the composite with 10wt.% SiC.
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