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pISSN : 1598-706X / eISSN : 2288-8381


(논문)연구논문

한국주조공학회지 (23권6호 320-327)

Role of Zinc Content in the mechanical Properties of Sn-3.5Ag Solder

Sn-3.5Ag 땜납의 Zn 첨가가 기계적 특성에 미치는 영향

Do-Jae. Lee, Kwang-Min Lee, Kyung-Ku Lee, Tae-Wook Oh and Dae-Hwa Baek

Chonnam National Univ., Kwangju Chonnam Regional Small and Medium Business Office

Abstract

Effects of Zn concentration on the mechanical properties of Sn-3.5Ag solder were studied, and compared to those of Sn-40Pb alloy which is widely used currently in electronics industry. Aging treatments were performed at 100 and 150°C for up to 120days and then were examined changes of microstructure by optical microscopy, SEM and EDS. Sn-3.5Ag solder was loaded to failure at cross head speed of 0.3 mm• min min-1 to measure strength and elongation. Aging treatment changed more or less the tensile properties of the solder itself. In short, Sn-Ag base alloy showed decrease in tensile strength and increase in elongation with prolonged aging time. Sn-3.5Ag alloy showed more sensitive changes in tensile properties than Sn-3.5Ag-lZn alloy by aging. On the other hand, Sn-40Pb alloy showed decreasing tendances in both tensile strength and elongation by aging.

Keywords

Pb-free solder, Sn-3.5Ag, Aging, Tensile Strength