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pISSN : 1598-706X / eISSN : 2288-8381


한국주조공학회지 (38권3호 55-59)

Interfacial Characteristics of Al-Cu Cast Composites for High Conductivity Applications

고전도성 부품용 Al-Cu 주조복합재료의 계면 특

Jeong-Min Kim†, Nam-Hoon Kim and Se-Hyun Ko*

Hanbat National University, Korea Institute of Industrial Technology



To optimize the conductivity and to reduce the weight by as much as possible, Al-Cu composites were prepared through a suction- casting procedure. Pure copper metal foam was infiltrated by melted aluminum with th the use of the vacuum, after which warm rolling was conducted to remove several remaining pores at the interface between the C Cu foam and the aluminum matrix. Despite the short casting time, significant dissolution of Cu into the melt was observed. Moreover, it was found that various Al-Cu intermetallic compounds arose at the interface during the isothermal heating process after the c casting and rolling steps. The average thickness of the Al-Cu intermetallic compound tended to increase in proportion to the he heating time. The electrical and thermal conductivity levels of the cast composites were found to be comparatively low, mainly due to the d dissolution of the Cu foam and the formation of intermetallics at the interface.


Copper foam, Aluminum, Composites, Conductivity, Intermetallic compound